Identifying wafer fabrication system impacts resulting from specified actions

ABSTRACT

A method and system for use in wafer fabrication systems. The method and system identify wafer fabrication system impacts resulting from specified actions by specifying at least one action related to at least one integral part associated with the wafer fabrication system, and generating a presentation of at least one impact upon at least one integral part associated with the wafer fabrication system arising from the at least one action related to the at least one integral part associated with the wafer fabrication system.

CROSS-REFERENCE

The present invention is related to subject matter disclosed in thefollowing co-pending application:

1. United States patent application entitled, “Identifying RelationshipsAmong Constituent Parts Of A Wafer Fabrication System”, U.S. Ser. No.09/352989 naming Timothy C. Dean as the inventor, filed substantiallycontemporaneously with the present application and incorporated byreference herein in its entirety; and

2. United States patent application entitled, “Capturing An EvolvingWafer Fabrication Method And System”, U.S. Ser. No. 09/352953 now U.S.Pat. No. 6,467,077 naming Timothy C. Dean as the inventor, filedsubstantially contemporaneously with the present application andincorporated by reference herein in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates, in general, to wafer fabrication systems.

2. Description of the Related Art

The production of semiconductor devices consists of many layers ofchemical compounds applied to or removed from a silicon base. The baseis a disk known as a “wafer”. Depending on wafer size and chipcomplexity, each wafer can contain 25 to several hundred separateidentical chips.

Using photolithography, the pattern of electrical circuits for a givenlayer is captured on the wafer. The image is developed, and the wafermoves to another process, either adding or modifying a layer, or etchingit out in the pattern of the lithographic image. This process isrepeated many many times in many layers to get a full 3-D electroniccircuit. The dimensions of these circuits are incredibly tiny. Presenttechnology is in the range of 0.25 micron line width or feature size.

Wafer fabrication systems are utilized to manufacture semiconductordevices. A wafer fabrication system can be conceived of as beingcomposed of production equipment and utility systems. Productionequipment can be conceived of as being composed of functional unitsknown in the art as “production tools.” Utility systems can be conceivedof as being composed of functional units known in the art as “items ofutility system equipment.”

Prior to the initial installation of a wafer fabrication system, theproduction equipment and utility systems are individually designed andintegrated together using top down engineering design techniques inorder to yield the wafer fabrication system. Each individual productionequipment and utility system design, as well as the overall waferfabrication system design, is typically recorded in its own equipmentlayout plan drawing.

Subsequent to the initial installation of a wafer fabrication system, itis common within the industry to take a “modular” approach to theproduction equipment and utility systems making up the wafer fabricationsystem. That is, the constituent parts of the production equipment andthe utility systems are treated as functional members that can beindependently added, modified, replaced, relocated, removed, or upgradedwith only concern for impacts local to the modification, replacement,relocation, removal, or upgrade.

With respect to the manufacture of semiconductor devices, there arehundreds of different production tools utilized to apply or remove orcondition the various layers within the semiconductor device.Additionally, there are dozens of different chemicals required toproduce the desired effects. The different chemicals require separatedistribution, or utility, systems to deliver them.

Use of the modular approach to production equipment and utility systemsallows the piecemeal addition, modification, replacement, relocation,removal, and/or upgrading of production tools making up the productionequipment and items of utility equipment making up the utility systemsas new process steps become necessary, or when production tools areimproved. In practice, there are many advantages to the modularapproach. One advantage is that the modular approach is highly efficientand effectively allows an existing wafer fabrication system tocontinuously evolve over time in order to meet expanding demand andchanging manufacturing procedures. In a sense, a wafer fabricationsystem resulting from the modular approach is the best system possiblein that it is uniquely adapted to the needs at hand, a fact which arisesfrom its evolutionary growth in response to a changing environment ofpresent and future needs.

One significant disadvantage to a wafer fabrication system utilizing themodular approach is that its evolutionary growth pattern means thatthere is no overall conscious design, or plan, applicable to the waferfabrication system which has been evolving for any significant length oftime. In theory, this disadvantage could be overcome by maintainingextensive documentation about the wafer fabrication system as itevolved. In practice, this has not happened.

The semiconductor device manufacturing industry has been in the midst ofsustained capacity expansion for years. To keep up with demand,companies have been installing and updating production equipment anditems of utility system equipment on a need-driven basis. Consequently,many of today's semiconductor device wafer fabrication systems consistof a bewildering array of production tools and items of utility systemequipment assembled together in response to past needs. While such waferfabrication systems do work exceptionally well, they give rise tosignificant difficulties from the standpoint of facilities engineersattempting to manage, maintain, or upgrade such wafer fabricationsystems.

One such difficulty arises from the lack of documentation, andconsequent lack of understanding, concerning the interrelationships ofthe production tools composing the production equipment. Anotherdifficulty arises from the lack of documentation, and consequent lackunderstanding, concerning the interrelationships of the items of utilitysystem equipment composing the utility systems. Yet another difficultyarises from lack of documentation, and consequent lack understanding,concerning the interrelationships of the various production tools anditems of utility system equipment. This lack of documentation andunderstanding exists since existing wafer fabrication systems, composedof production equipment made up of various and sundry production toolsand utility systems made up of various and sundry items of utilitysystem equipment, are the result of sustained evolution, often over aperiod of several years, in response to needs that had to be satisfiedimmediately (e.g., either to avoid a shutdown of the facility or toquickly ramp up for production of a new product or quantity of product).

The result of the foregoing described process or real-time installationand modification is a highly evolved sprawl of well-functioningproduction equipment which is often partially undocumented (that is,because of the rapid modification without documentation, the originalequipment layout plan drawings quickly become inaccurate representationsof the production equipment and utility systems making up a waferfabrication system). That is, since the production tools (and theirsupporting items of utility system equipment) had to be installed and/ormodified virtually in real time, time for documenting suchinstallations/modifications did not typically exist at the time of suchinstallations/modifications. Furthermore, rapid growth in the industryhas also typically meant that one real-time project has followed on theheels of a preceding real-time project. Consequently, often, time is notavailable to go back and document the changes in production tools andtheir supporting distribution systems which gave rise to existingproduction equipment. Thus, existing wafer fabrication systems are inthe main vastly undocumented. This lack of documentation gives rise to acorresponding lack of information regarding the overall systemfunctioning.

Incomplete documentation and overall wafer fabrication systemunderstanding poses several grave difficulties to facilities engineersdue to the overwhelming complexity of existing systems. The followingexample of an existing system will help to demonstrate a few of thedifficulties arising from such complexity and lack of documentation.

At the NEC Electronics, Inc. semiconductor device manufacturing facilityin Roseville, California, there are literally hundreds of productiontools in place, which, as discussed above, collectively make up theproduction equipment. A great number of the relationships andinterrelationships of the production tools in place are poorlydocumented or undocumented for the reasons set forth above. In addition,connected to the production tools in place are the following utilities,many of which have relationships and interrelationships that arelikewise undocumented. Thirty-five (35) bulk liquid chemical supply orreturn systems. These chemical supply and return system carry varioustypes of chemical ranging from IPA to MEK to HF to H2SO4 and manyothers. Four (4) different types of electrical power systems, all atvarious voltages. Five (5) different types of communication systems.Eleven (11) bulk gas systems. These bulk gas systems carry various typesof chemical including Argon, Nitrogen, Hydrogen, Oxygen, compressed air,etc. Forty (40) bottled gas systems (serving only1-5 tools). Thesebottled gas systems include several types of gases such as freons, CO2,HBr, Ne—Kr—F, PH3, SF6, etc. Four (4) major process exhaust systems:acid exhaust, alkali exhaust, organic exhaust, powder exhaust. (Each hasseveral scrubbers to release only cleaned air to the atmosphere.)Several (e.g., house and process) vacuum systems. Six (6) wastewatersystems for different chemical mixtures. Five (5) water systems: Coolingsupply & return, super high purity (deionized or DI) water, hot DIwater, industrial water.

Those skilled in the art will recognize that each of the foregoingdescribed utility systems contains utility system equipment such asmains, valves, panelboards, branches, plus all sorts of generationequipment, pumps, tanks, pressure reducing stations, etc. Those skilledin the art will further realize that the number of utilities serving theproduction equipment fluctuates constantly, as the mix of differenttools evolves and changes. Those skilled in the art will yet furtherrealize that it is common for as many as 20 of the foregoing describedutility systems to come together at a single production tool, dependingupon the necessary requirements (e.g., chemical, vacuum, power, andcooling requirements) of the production tool.

As noted above, the modular approach to wafer fabrication systems allowsthe addition, modification, replacement, relocation, removal, and/orupgrading of individual production tools and items of utility equipment.Unfortunately, the addition, modification, replacement, relocation,removal, and/or upgrading of such production tools and items of utilityequipment is generally not just a simple matter of stopping the waferfabrication system, plugging in the new production tool or item ofutility equipment, and re-starting the system. Insofar as productiontools are typically being served by a number of different utilities, andinsofar as the production tools are themselves often serving as conduitsfor utilities to other production tools, the addition, modification,replacement, relocation, removal, and/or upgrading of production toolsor items of utility system equipment often requires that the productiontools and/or utilities surrounding the production tool(s) or item(s) tobe replaced or modified be taken off line.

More often than not, the addition, modification, replacement,relocation, removal, and/or upgrading of production tools or items ofutility system equipment requires extensive engineering modification ofexisting production tools and utility systems, such as retrofittingconnections, adjusting power supplies, modifying software controls, etc.in order to make the added, modified, replaced, relocated, removed,and/or upgraded production tools or items of utility system equipmentfunction effectively. This operation of “integrating” a new productiontool into existing production equipment is known in the art by the term“hook-up”. Those skilled in the art will recognize that there are alwaysunforeseen difficulties which arise during hook-up. These difficultiesneed to be overcome in order to for the new production tool or items ofutility system equipment to function effectively. Overcoming thesedifficulties takes time, and can sometimes take a great deal of time.

Insofar as adding, modifying, replacing, relocating, removing, and/orupgrading production tools or items of utility system equipment canrequire that all or part of a wafer fabrication system be shut down, itis extremely important that the facility engineers deciding whether ornot to deploy new production tools or items of utility system equipmentbe able to estimate the worst case scenarios in order to determine aplan of installation having substantially no effects on the waferfabrication system operation. This means that they need to be able toestimate the effect on the wafer fabrication system of taking off-linethe production tools or items of utility system equipment necessary toeffect the change/modification. Unfortunately, assessing such worse casescenarios is not something easily done in the art due to the lack ofdocumentation and understanding regarding the interrelationships of theproduction tools and their supporting utilities within the evolvedexisting wafer fabrication systems.

Since in the art there is typically no adequate description of theinterrelationships within the evolved system, it is very difficult forfacility engineers to anticipate the effects of proposed changes toproduction equipment or utility systems. That is, if the relationshipsare not well documented, it is very difficult to anticipate the effectof, say, shutting off a valve delivering sulfuric acid to a tool,especially if that valve serves several conduits or the tool itselfserves several other tools. Since the interrelationships betweencomponents of the production equipment, the interrelationships betweencomponents of the utilities serving the production equipment, and theinterrelationships between the components of the production equipmentand the components of the utilities may not be generally well known ordocumented, shutting down parts of the system often has many unexpectedeffects. Those skilled in the art will recognize that this lack ofknowledge is undesirable, and makes an already risky operation morerisky.

In the absence of the present invention, the common approach to theforegoing noted difficulties is for each utility to be separately (whichare usually outdated, for the reasons set forth above) documented on alarge blueprint drawing (or drawings) of its own. To examine all theutilities at a given production tool, many drawings must be researched(typically at least one drawing per each utility).

Those skilled in the art will recognize that, for a proposed addition toor modification of a group of tools (such modifications tend to come ingroups needed to support a certain product and defined quantity of theproduct), facilities construction engineers, utilizing the existing (andtypically outmoded) blueprint drawings on a piecemeal basis, prepare autility matrix—a listing of the utility demands for the entire group ofproduction tools to be modified. Thereafter, the construction engineersevaluate the matrix to determine if utility service is adequate in theproposed locations, or whether system upgrades will be required. Ifsystem upgrades will be required, the type and cost of the upgrade aredetermined.

As product planners attempt to refine their production mix, several suchproposed modifications occur throughout the year. Thus, from a planningstandpoint the foregoing described procedure is very labor intensive andfraught with risk. Notwithstanding the foregoing, that risk becomes realand the dangers present when a design decision is made and the changesactually implemented.

Those skilled in the art will recognize that, even if the evolutionarynature of the system had been well documented, from a practicablestandpoint it is extremely difficult to represent all the hook-upinformation related to installing or modifying production tool(s) as adrawing single. In most practical instances, there are just too manybranch lines feeding any one production tool. With hundreds of tools anddozens of utilities interlinked, such a diagram would be a veryconvoluted web, virtually impossible to draw even if it could beunderstood.

Those skilled in the art will also recognize that even if theevolutionary nature of the production equipment and utility systemsmaking up the wafer fabrication system had been well documented, from apracticable standpoint it is extremely difficult to represent waferfabrication system-wide impacts related to installing or modifyingproduction tool(s) and/or utility systems. The practical reasons forthis is that most wafer fabrication systems maintain separate blueprintdrawings for separate production tools and utility systems, which makesan overall wafer fabrication system assessment of likely impactssubstantially impracticable.

It is therefore apparent that a need exists in the art for a method andsystem which can dynamically learn, coordinate, and present the massiveamount of production tool and utility interconnect data from existingand evolving wafer fabrication systems, and present such learnedinformation in such a fashion that the costs, benefits, and impacts ofany proposed modifications of production equipment and/or utilities onparts of the wafer fabrication system can be adequately accessed.

SUMMARY OF THE INVENTION

A method and system have been invented which can dynamically learn,coordinate, and present the massive amount of production tool andutility interconnect data from existing and evolving wafer fabricationsystems, and present such learned information in such a fashion that thecosts, benefits, and impacts of any proposed modifications of productionequipment and/or utilities on parts of the wafer fabrication system canbe adequately accessed. The method and system identify wafer fabricationsystem impacts resulting from specified actions by specifying at leastone action related to at least one integral part associated with thewafer fabrication system, and generating a presentation of at least oneimpact upon at least one integral part associated with the waferfabrication system arising from the at least one action related to theat least one integral part associated with the wafer fabrication system.

The foregoing is a summary and thus contains, by necessity,simplifications, generalizations and omissions of detail; consequently,those skilled in the art will appreciate that the summary isillustrative only and is not intended to be in any way limiting. Otheraspects, inventive features, and advantages of the present invention, asdefined solely by the claims, will become apparent in the non-limitingdetailed description set forth below.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention may be better understood, and its numerousobjects, features, and advantages made apparent to those skilled in theart by referencing the accompanying drawings.

FIG. 1A is a pictographic representation of how the signifiers utilizedby processes and devices herein relate to existing wafer fabricationsystem signifiers.

FIG. 1B depicts a pictographic of representation of how the signifiersutilized and viewed by the various processes and devices described belowdiffer from these illustrated in FIG. 1A.

FIG. 2 depicts a high-level logic flowchart of a process by which anevolving wafer fabrication system can be captured.

FIG. 3 illustrates a high-level logic flowchart showing several examplesof the selection of the at least one integral part.

FIG. 4 shows a high-level logic flow chart showing several examples ofmapping.

FIG. 5 shows a high-level logic flowchart showing an example of howmapping can be achieved.

FIG. 6 shows a high-level logic flowchart showing an example of howmapping can be achieved.

FIG. 7 illustrates a high-level logic flowchart showing an example ofthe selection of at least one integral part.

FIG. 8 shows a high-level logic flowchart showing an example of theselection of at least one integral part on a granular basis.

FIG. 9 shows a high-level logic flowchart showing several examples ofthe selection of the at least one component (as the term component isdefined and used herein) associated with the wafer fabrication system.

FIG. 10 shows a high-level logic flowchart showing an example of theselection of at least one integral part on a granular basis.

FIG. 11 shows a high-level logic flowchart showing several examples ofthe selection of the at least one control (as the term control isdefined and used herein) associated with the wafer fabrication system.

FIG. 12 shows a high-level logic flowchart showing an example of theselection of the at least one integral part on a granular basis.

FIG. 13 shows a high-level logic flowchart showing several examples ofthe selection of the at least one connection (as the term connection isdefined and used herein) associated with the wafer fabrication system.

FIG. 14 shows apart of an evolving wafer fabrication system.

FIG. 15 shows the items of FIG. 14 designated as components, controls,or connections.

FIG. 16 shows a lattice diagram of Components, Controls, Connectionsitems of FIGS. 14 and 15.

FIG. 17 depicts a high-level logic flowchart of a process by which thecaptured data can be utilized to give an up-to-date picture of therelationships between the captured integral parts of the waferfabrication system.

FIG. 18 illustrates a high-level logic flowchart showing severalexamples of the generation and presentation of at least one relationshipbetween the at least one integral part associated with the waferfabrication system and at least one other integral part associated withthe wafer fabrication system.

FIG. 19 shows a high-level logic flow chart showing an example of theaccessing at least one mapping between the at least one integral partassociated with the wafer fabrication system and the at least one otherpart of the wafer fabrication system.

FIG. 20 shows a high-level logic flowchart showing an example of how theidentification of at least one integral part associated with a waferfabrication system can be achieved.

FIG. 21 shows a high-level logic flowchart showing an example of theidentification of at least one integral part done on a granular basis.

FIG. 22 shows a high-level logic flowchart showing several examples ofthe identification of the at least one component (as the term componentis defined and used herein) associated with the wafer fabricationsystem.

FIG. 23 shows a high-level logic flowchart showing an example of theidentification of at least one integral part on a granular basis.

FIG. 24 shows a high-level logic flowchart showing several examples ofthe identification of the at least one control (as the term control isdefined and used herein) associated with the wafer fabrication system.

FIG. 25 shows a high-level logic flowchart showing an example of theidentification of at least one integral part on a granular basis.

FIG. 26 shows a high-level logic flowchart showing several examples ofthe selection of at least one connection (as the term connection isdefined and used herein) associated with the wafer fabrication system.

FIG. 27 shows a high-level logic flowchart showing an example of thegeneration and presentation of at least one relationship between the atleast one integral part associated with the wafer fabrication system andat least one other integral part associated with the wafer fabricationsystem.

FIG. 28 shows a high-level logic flowchart showing an example ofrecalling at least one ordering scheme.

FIG. 29A shows grouping based on facilities engineering concepts.

FIG. 29B shows pictographically some the aspects set forth in FIG. 29A.

FIG. 30A through FIG. 30H (include all screen shots) shows a method ofpresenting on a computer screen the ordering scheme and therelationships between WFS integral parts.

FIG. 31 depicts a high-level logic flowchart of a process by which oneor more impacts upon an evolving wafer fabrication system may be known.

FIG. 32 shows a high-level logic flowchart showing several examples ofthe specification of at least one action related to the identifiedintegral part associated with a wafer fabrication system.

FIG. 33 shows a high-level logic flow chart showing an example of thegeneration and presentation of at least one impact upon at least oneintegral part associated with the wafer fabrication system arising fromthe at least one action related to the at least one integral partassociated with the wafer fabrication system.

FIG. 34 shows a high-level logic flowchart showing an example ofidentifying at least one directly-affected integral part of the waferfabrication system.

FIG. 35 shows a high-level logic flowchart showing an example ofidentifying at least one directly-affected integral part of the waferfabrication system.

FIG. 36 shows a high-level logic flowchart showing a process whereinindirectly-affected integral parts of a wafer fabrication system aretaken into account.

FIG. 37 shows a high-level logic flowchart showing examples of theidentification of at least one indirectly-affected integral part of thewafer fabrication system linked with the at least one directly-affectedintegral part of the wafer fabrication system.

FIG. 38 shows a high-level logic flowchart showing an example ofidentifying at least one indirectly-affected integral part of the waferfabrication system linked with the at least one directly-affectedintegral part of the wafer fabrication system.

FIG. 39 shows a high-level logic flowchart showing an example of theidentifying at least one coupling between an integral part of the waferfabrication system and the at least one directly-affected integral partof the wafer fabrication system.

FIG. 40 shows a high-level logic flowchart showing an example ofidentification of the at least one directly affected integral part on agranular basis.

FIG. 41 shows a high-level logic flowchart showing several examples ofidentification of at least one directly affected component (as the termcomponent is defined and used herein) associated with the waferfabrication system.

FIG. 42 shows a high-level logic flowchart showing an example ofidentification of at least one directly affected integral part on agranular basis.

FIG. 43 shows a high-level logic flowchart showing several examples ofthe identification of the at least one directly affected control (as theterm control is defined and used herein) associated with the waferfabrication system.

FIG. 44 shows a high-level logic flowchart showing an example of theidentification of at least one directly affected integral part on agranular basis.

FIG. 45 shows a high-level logic flowchart showing several examples ofthe identification of at least one directly affected connection (as theterm connection is defined and used herein) associated with the waferfabrication system.

FIG. 46 shows a high-level logic flowchart showing an example of theidentification of the at least one indirectly affected integral part ona granular basis.

FIG. 47 shows a high-level logic flowchart showing several examples ofidentification of at least one indirectly affected component (as theterm component is defined and used herein) associated with the waferfabrication system.

FIG. 48 shows a high-level logic flowchart showing an example of theidentification of at least one indirectly affected integral part on agranular.

FIG. 49 shows a high-level logic flowchart showing several examples ofthe identification of the at least one indirectly affected control (asthe term control is defined and used herein) associated with the waferfabrication system.

FIG. 50 shows a high-level logic flowchart showing an example of theidentification of at least one indirectly affected integral part on agranular basis.

FIG. 51 shows a high-level logic flowchart showing several examples ofthe identification of at least one indirectly affected connection (asthe term connection is defined and used herein) associated with thewafer fabrication system.

FIG. 52 shows a high-level partially schematic diagram depicting aprocess by which captured data can be utilized to give an up-to-datepicture of the relationships between the captured integral parts of thewafer fabrication system.

FIGS. 53A and 53B show a high-level partially schematic diagramdepicting a process by which one or more impacts upon an evolving waferfabrication system may be known.

FIG. 54 shows a proposed graphical user interface which can be utilizedto accept a user specification of an action on at least one integralpart of a wafer fabrication system.

The use of the same reference symbols in different drawings indicatessimilar or identical items.

DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

The following sets forth a detailed description of the best contemplatedmode for carrying out the multiple independent inventions describedherein. The description is intended to be illustrative and should not betaken to be limiting. In addition, the following detailed descriptionhas been divided into sections (e.g., sections I-II) in order tohighlight the inventions described herein; however, those skilled in theart will appreciate that such sections are merely for illustrativefocus, and that the inventions herein disclosed typically draw theirsupport from multiple sections. Consequently, it is to be understoodthat the division of the detailed description into separate sections ismerely done as an aid to understanding and is in no way intended to belimiting.

As noted in the description of the related art section, modem waferfabrication systems evolve in a piecewise fashion. The followingdescribes processes and devices for capturing a wafer fabrication systemas it evolves, with the ability to perform such capturing from virtuallyany point in the development of the wafer fabrication system. Alsodescribed are processes and devices which can utilize a captured waferfabrication system to discern what impact or impacts a given actiontaken with respect to a portion of a wafer fabrication system willgenerate. Additionally described are processes and devices which utilizea captured wafer fabrication system to generate representations of theway in which various defined portions of the wafer fabrication systeminteract with and influence each other.

One significant aspect utilized herein is a devised treatment of“granular” wafer fabrication systems. This treatment radicallydeconstructs the relationships in which constituent parts of waferfabrication systems are typically manipulated and viewed. Instead,processes and devices described herein manipulate and view each waferfabrication system as an agglomeration of “granular” integral members,with each such granular member being defined by its relations (e.g.,logical, mechanical, electrical, chemical, etc.) with other granularintegral members, irrespective of how such granular integral members maypreviously have been understood, viewed, and/or defined. This radicaldeconstruction, and how it relates to existent manipulations and viewsof a wafer fabrication system, is presented pictographically in FIGS. 1Aand 1B.

Referring now to FIG. 1A, shown is a pictographic representation of howthe signifiers utilized by processes and devices herein relate toexisting wafer fabrication system signifiers. Depicted in FIG. 1A is thewafer fabrication system signifier 100 which signifies the totality ofeverything other than human input necessary to fabricate integratedcircuits. Shown is that wafer fabrication system signifier 100 can befurther subdivided into production equipment signifier 102 (rememberthat equipment, as commonly used, is plural) and utility systemssignifier 104.

Depicted is that production equipment signifier 102 can be furtherbroken down into production tool₁ signifier 1041 through productiontool_(M) signifier 104M (where M is some integer greater than 1).Illustrated is that each production tool signifier can be further brokendown into a number of sub-units of production tools. For example, shownis that production tool₁ signifier 1041 can be broken down intosub-unit₁ of production tool₁ signifier 1061, sub-unit₂ of productiontool₁ signifier 1062, . . . , and sub-unit_(p) of production tool₁signifier 106P (where P is some integer greater than 1).

Depicted is that utility systems signifier 104 can be further brokendown into utility system₁ equipment signifier 1081 through utilitysystem_(N) equipment signifier 108N (where N is some integer greaterthan 1). Illustrated is that each utility system signifier can befurther broken down into a number of items of utility systems. Forexample, shown is that utility system_(N) 108N can be broken down intoitem₁ of utility system_(N) signifier 1091, item₂ of utility system_(N)signifier 1092, . . . , and item_(Q) of utility system_(N) signifier109Q (where Q is some integer greater than 1).

Referring now to FIG. 1B, depicted is a pictographic of representationof how the signifiers utilized and viewed by the various processes anddevices described below differ from these illustrated in FIG. 1A.Illustrated in FIG. 1B is that the hierarchical arrangement ofsignifiers of FIG. 1A has been deconstructed, and that that thesignifiers have been reconstructed on a different basis—namely, thesignifiers' interactions with each other. Notice that the hierarchicalrelationships of FIG. 1A have been supplemented by a web ofinterrelationships, depicted in FIG. 1B, which essentially ignores thehierarchical relationships of FIG. 1A. Instead, the process and devicesutilized herein define each of the sub-units of production tools anditems of utility systems making up a wafer fabrication system as“granular” integral part signifiers 150 (the basic granular signifiersutilized herein are components, controls, and connection, and aredescribed in more detail below).

Granular integral parts 150 are interlinked by coupling signifiers 152(basic coupling signifiers utilized herein are electrical, mechanical,chemical, and thermal, and are described in more detail below). As canbe seen, the granular integral part signifiers 150 and couplingsignifiers 152 deconstruct wafer fabrication system 100 into a mass ofinterlinked and interwoven granular parts. This gives rise to a numberof advantages which become apparent in the following discussion.

I. Capturing an Evolving Wafer Fabrication System

As noted in the description of the related art section, modern waferfabrication systems evolve in a piecewise fashion. The followingdescribes processes and devices for capturing a wafer fabrication systemas it evolves from virtually any point in its development. Furthermore,the following described processes and devices allow for the piecewiseacquisition of information about the evolving system, and thus can beutilized to capture an evolving wafer fabrication system starting withbasically any integral aspect of the system, at basically any point intime during the evolution of the wafer fabrication system. Furthermore,it is to be understood that multiple independent versions of the belowdescribed processes and devices can be used independent of each other.Thereafter, each multiple version can be used to characterize a portionof the evolving wafer fabrication system which that version hascaptured. Furthermore, if desired, each such multiple version caneventually be “linked up” to other of the multiple independent versionsto create a coherent linked whole.

With reference now to FIG. 2, depicted is a high-level logic flowchartof a process by which an evolving wafer fabrication system can becaptured. Method step 200 shows the start of the process. Method step202 depicts the selection of at least one integral part associated witha wafer fabrication system. Method step 204 illustrates the mapping ofat least one interaction between the integral part selected in methodstep 202 and at least one other integral part associated with the waferfabrication system. Method step 206 shows the end of the process.

Referring now to FIG. 3, illustrated is a high-level logic flowchartshowing several examples of the selection of the at least one integralpart referenced in method step 202. Method step 300 illustrates that inone instance, the selection of the at least one integral part referencedin method step 202 can be the selection of at least one production tool.Method step 302 shows that in a second instance, the selection of the atleast one integral part referenced in method step 202 can be theselection of at least one integral item of at least one production tool.Method step 304 shows that in a third instance, the selection of the atleast one integral part referenced in method step 202 can be theselection of at least one utility system. Method step 306 shows that ina fourth instance the at selection of at least one integral part can bethe selection of at least one item of at least one utility system. Theremaining shown steps function substantially as like-numbered stepsdescribed previously.

Referring now to FIG. 4, shown is a high-level logic flow chart showingseveral examples of the mapping illustrated in method step 204. Methodstep 400 illustrates that in one instance, mapping at least oneinteraction between the integral part selected in method step 202 and atleast one other integral part associated with the wafer fabricationsystem, as was referenced in method step 204, can be the mapping of atleast one mechanical coupling between the at least one integral partselected in method step 202 and at least one other integral partassociated with the wafer fabrication system. Method step 402 shows thatin a second instance, mapping at least one interaction between theintegral part selected in method step 202 and at least one otherintegral part associated with the wafer fabrication system as wasreferenced in method step 204, can be the mapping of at least oneelectrical coupling between the integral part selected in method step202 and at least one other integral part associated with the waferfabrication system. Method step 404 shows that in a third instance,mapping at least one interaction between the integral part selected inmethod step 202 and at least one other integral part associated with thewafer fabrication system, as was referenced in method step 204, can bethe mapping of at least one chemical coupling between the integral partselected in method step 202 and at least one other integral partassociated with the wafer fabrication system. Method step 406 shows thatin a fourth instance, mapping at least one interaction between theintegral part selected in method step 202 and at least one otherintegral part associated with the wafer fabrication system, as wasreferenced in method step 204, can be the mapping of at least onethermal coupling between the integral part selected in method step 202and at least one other integral part associated with the waferfabrication system. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 5, shown is a high-level logic flowchart showingan example of how the mapping illustrated in method step 204 can beachieved. Method step 500 illustrates that in one instance, mapping atleast one interaction between the at least one integral part selected inmethod step 202 and at least one other integral part associated with thewafer fabrication system, as was referenced in method step 204, can beachieved by the creation of a data structure for the at least oneintegral part selected in method step 202. In one embodiment, this isachieved via the creation of a relational database entry. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 6, shown is a high-level logic flowchart showingan example of how the mapping illustrated in method step 204 can beachieved. Method step 600 illustrates that in one instance, mapping atleast one interaction between the at least one integral part selected inmethod step 202 and at least one other integral part associated with thewafer fabrication system, as was referenced in method step 204, can beachieved by the creation of a data structure for the at least oneintegral part selected in method step 202 where the data structure hasat least one central coupling and at least one peripheral² coupling forthe at least one integral part associated with the wafer fabricationsystem. In one embodiment, this is achieved via the creation of arelational database entry. The remaining shown steps functionsubstantially as like-numbered steps described previously.

¹ As used herein, “central” indicates towards the source of the utility.Visualize a tree trunk. Connection capacities are larger towards thecentral end of the utility distribution. Switchgear, boilers, and pumpsare typically towards the center of utility systems.

² As used herein, “peripheral” indicates towards the outer edges of theutility distribution. Visualize twigs and leaves of a tree. Connectioncapacities are smaller. Production tools and plumbing fixtures aretypically towards the periphery of utility systems.

Referring now to FIG. 7, illustrated is a high-level logic flowchartshowing an example of the selection of at least one integral partreferenced in method step 202. Method step 700 illustrates that in oneinstance, the selection of the at least one integral part referenced inmethod step 202 can be the selection of at the at least one integralpart is done on a granular basis. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 8, shown is a high-level logic flowchart showingan example of the selection of at least one integral part on a granularbasis, as referenced in method step 700. Method step 800 illustratesthat in one instance, the selection of at least one integral part doneon a granular basis, referenced in method step 700, involves selectingat least one component³ associated with the wafer fabrication system.The remaining shown steps function substantially as like-numbered stepsdescribed previously.

³ As used herein, a “Component” typically consumes utilities forpurposes not related to the utility being consumed, such as heatingwater or processing wafers. Components often are linked to multipleutilities. A Component is a primary interface location for human use ofthe utility systems. Examples of Components include: production tools,scrubbers, boilers, pumps, etc.

Referring now to FIG. 9, shown is a high-level logic flowchart showingseveral examples of the selection of the at least one component (as theterm component is defined and used herein) associated with the waferfabrication system referenced in method step 800. Method step 900illustrates that in a first instance, the selection of the at least onecomponent (as the term component is defined and used herein) associatedwith the wafer fabrication system, referenced in method step 800, caninvolve selecting at least one production tool. Method step 902illustrates that in a second instance, the selection of the at least onecomponent (as the term component is defined and used herein) associatedwith the wafer fabrication system, referenced in method step 800, caninvolve selecting at least one sub-unit of at least one production tool.Method step 906 illustrates that in a third instance, the selection ofthe at least one component (as the term component is defined and usedherein) associated with the wafer fabrication system, referenced inmethod step 800, can involve selecting at least one item of utilitysystem equipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 10, shown is a high-level logic flowchart showingan example of the selection of at least one integral part on a granularbasis, as referenced in method step 700. Method step 1000 illustratesthat in one instance, the selection of at the at least one integral partdone on a granular basis, referenced in method step 700, involvesselecting at least one control⁴ associated with the wafer fabricationsystem. The remaining shown steps function substantially aslike-numbered steps described previously.

⁴ As used herein, a “Control” modifies or meters a utility as it flowsby. Manual controls only link to a single utility. Automatic Controlslink to two utilities—the one being controlled and the one doing thecontrolling. A Control does not consume utilities. Examples include:valves, dampers, circuit breakers, flow meters, transformers, sensors,etc.

Referring now to FIG. 11, shown is a high-level logic flowchart showingseveral examples of the selection of the at least one control (as theterm control is defined and used herein) associated with the waferfabrication system referenced in method step 1000. Method step 1102illustrates that in a first instance, the selection of the at least onecontrol (as the term control is defined and used herein) associated withthe wafer fabrication system, referenced in method step 1000, caninvolve selecting at least one sub-unit of at least one production tool.Method step 1104 illustrates that in a third instance, the selection ofthe at least one control (as the term control is defined and usedherein) associated with the wafer fabrication system, referenced inmethod step 1000, can involve selecting at least one item of utilitysystem equipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 12, shown is a high-level logic flowchart showingan example of the selection of the at least one integral part on agranular basis, as referenced in method step 700. Method step 1200illustrates that in one instance, the selection of at the at least oneintegral part done on a granular basis, referenced in method step 700,involves selecting at least one connection⁵ associated with the waferfabrication system. The remaining shown steps function substantially aslike-numbered steps described previously.

⁵ As used herein, a “Connection” transports a single utility. It may beeither linear (only two links) or branching (many links). There is nohuman interaction. Examples of Connections include: pipes, ducts, wyes &tees, wires, valve manifolds, breaker panels, etc. Connection itemrecords are where CCC tracks flow and pressure quantity data.

Referring now to FIG. 13, shown is a high-level logic flowchart showingseveral examples of the selection of the at least one connection (as theterm connection is defined and used herein) associated with the waferfabrication system referenced in method step 1200. Method step 1300illustrates that in a first instance, the selection of the at least oneconnection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step1200, can involve selecting at least one production tool. Method step1302 illustrates that in a second instance, the selection of the atleast one connection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step1200, can involve selecting at least one utility system. Method step1304 illustrates that in one instance, the selection of the at least oneconnection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step1200, can involve selecting at least one item of utility systemequipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIGS. 14, 15, and 16, shown are “real world” examplesof components, connections, controls, and their corresponding couplings.Referring to FIG. 14, shown is optistation 1400. Optistation is suppliedwith necessary air via clean ordinary air supply (COA) 1402, via airtubing 1405. The supply of air delivered to optistation 1400 iscontrolled by air control valve 1404. Shown is that air valve 1404 isconnected to T-connection 1403, where one leg of T-connection 1403connects to air tubing 1407 and the other leg of T-connection 1403connects to air tubing 1409.

Electrical panel 1408 supplies optistation 1400 with electrical powervia electrical panel wiring 1410, electrical panel receptacle femaleconnector 1412, electrical panel receptacle male connector 1414 andelectrical power cord 1406. The supply of electricity is controlled viabreaker #54 1416.

Process vacuum supply 1418 supplies optistation 1400 with vacuum viavacuum tubing T-connection 1420. Process vacuum supply 1418 iscontrolled via vacuum control valve 1422 and wand 1424 via wand tubing1426. Process vacuum supply 1418 is supplied to vacuum control valve1422 via vacuum tubing T-connection 1423.

With reference now to FIG. 15, shown are the items of FIG. 14 designatedas components, controls, or connections, which are denoted by shapes1500, 1502, and 1504 which are drawn surrounding the items. Depicted isthat electrical panel 1408 has been designated connection 12.Illustrated is that breaker #54 1416 has been designated control 11.Shown is that electrical panel wiring 1410 has been designatedconnection 10. Depicted electrical panel receptacle female connector1412 has been designated connection 9. Illustrated is that electricalpanel receptacle male connector 1414 and electrical power cord 1406 havebeen collectively designated connection 6. Shown is that optistation1400 has been designated component 1. Depicted is that vacuum tubingT-connection 1420 has been designated connection 3. Illustrated is thatwand tubing 1426 has been designated connection 7. Shown is that wand1424 has been designated component 8. Illustrated is that vacuum valve1422 has been designated control 5. Shown is that vacuum tubingT-connection 1423 has been designated connection 14. Shown is that airtubing 1405 has been designated as connection 2. Depicted is that airvalve 1404 has been designated as control 4. Illustrated is thatT-connection 1403 has been designated as connection 15. Shown is thatair tubing 1407 has been designated as connection 13 and air tubing 1409has been designated as connection 15.

FIG. 15 helps illustrate various types of couplings between integralparts of wafer fabrication systems. A mechanical coupling is a couplingbased on that fact that coupled parts exchange or carry electricalenergy (i.e., are mechanically coupled). One example of a mechanicalcoupling is the coupling between air tubing 1405/connection 2 and airvalve 1404/control 4. Another example of a mechanical coupling is thecoupling between optistation 1400/component 1 and vacuum tubingT-connection 1420/connection 3.

An electrical coupling is a coupling based on the fact that coupledparts exchange or carry electrical energy (i.e., are electricallycoupled). One example of an electrical coupling is the coupling betweenelectrical panel 1408/connection 12 and breaker #54 1416/control 11, inthat even though the integral parts are physically an electrical panel1408 and a breaker #54 1416, their coupling is based on the fact thatthe integral parts carry electrical energy. Likewise for the depictedcoupling between electrical panel wiring 1410/connection 10 andelectrical panel receptacle female connector 1412/connection 9.

A chemical coupling is a coupling based on the fact that coupled partsexchange or carry certain chemicals (i.e., are chemically coupled). Oneexample of chemical coupling (for sake of illustration, air is viewedhere as a “chemical”)is the coupling between air tubing 1405/connection2 and optistation 1400/component 1, in that air is exchanged between theconnection and the component.

A thermal coupling is a coupling based on the fact that coupled partsexchange or carry thermal energy. For example, a coupling betweenoptistation 1400/component 1 and air conditioning unit (notshown)/component (not shown) in that heat is exchanged between the twocomponents. Likewise, virtually any depicted mechanical coupling couldbe alternatively viewed as a thermal coupling.

The foregoing described examples of couplings. It should be apparentfrom the foregoing that this scheme can allow the same coupling to beviewed in different ways depending on context. For example, two coupledintegral parts could be viewed as mechanically coupled (if mechanicalconcerns were of interest), electrically coupled (if electrical concernswere of interest), chemically coupled (if chemical concerns were ofinterest), and/or thermally coupled (if thermal concerns were ofinterest). Thus, the granular scheme described herein gives greatflexibility in capturing a wafer fabrication system beyond any theoryheretofore available.

With reference now to FIG. 16, shown is a lattice diagram of Components,Controls, Connections items of FIGS. 14 and 15. Also shown are centraland peripheral connections.

II. Generating Presentation of Relationships Involving Integral Parts ofEvolving Wafer Fabrication System

As was noted in the Description of the Related Art section, above, asignificant problem that arises with respect to an evolving waferfabrication system is that such system's evolving nature makes it verydifficult to determine with 100% certainty the actual mechanical,electrical, chemical, thermal, etc. relationships between the one ormore particular integral parts of the wafer fabrication system. As wasexplained in the Description of Related Art section, the longer a waferfabrication system has been in place and evolving, the more a problemexists with respect to knowing the relationships between the integralparts of the wafer fabrication system. The foregoing section describedvarious processes and devices whereby an evolving wafer fabricationsystem could be partially or wholly captured at virtually any point inits evolution and from virtually any point within the wafer fabricationsystem. Once the wafer fabrication system has been captured, in whole orin part, the captured data can be utilized to give an up-to-date pictureof the relationships between the captured integral parts of the waferfabrication system, with an accuracy heretofore unavailable in theabsence of the present inventions.

Referring now to FIG. 52, shown is a high-level partially schematicdiagram depicting a process by which captured data can be utilized togive an up-to-date picture of the relationships between the capturedintegral parts of the wafer fabrication system. Method step 5200 depictsthe start of the process. Method step 5202 illustrates theidentification (typically done by a human user selecting between variouspresentation options via clicking a button on a graphical userinterface) of some integral part of wafer fabrication system 100. Methodstep 5204 shows the identification of one or more “granular” integralparts within a granular scheme, which for sake of illustration is shownas the “granular scheme” of FIG. 1B. Method step 5206 depicts thediscernment, or recalling, of one or more mapped interactions (e.g.,mechanical, electrical, chemical, and/or thermal couplings which werediscussed above) between or involving the identified one or moregranular integral parts and at least one other granular integral part.Method step 5208 illustrates the specification of a particularpresentation format (typically accomplished via a human user selectingbetween various presentation options by clicking a button on a graphicaluser interface). Method step 5210 shows the generation of a presentationin a manner consistent with the selected presentation option and theidentified one or more granular integral parts. As will be discussedbelow, the presentation can be in any format, and the fact that thepresentation is generated using the granular format should not be takento mean that the presentation must be in granular format. Rather, thegranular format allows virtually infinite flexibility in presentation,as will become apparent below. Method step 5212 shows the end of theprocess.

Referring now to FIG. 17, depicted is a high-level logic flowchart of aprocess by which the captured data can be utilized to give an up-to-datepicture of the relationships between the captured integral parts of thewafer fabrication system. Method step 1700 shows the start of theprocess. Method step 1702 depicts the identification of at least oneintegral part associated with a wafer fabrication system. Method step1704 illustrates the generation and presentation of at least onerelationship between the at least one integral part associated with thewafer fabrication system and at least one other integral part associatedwith the wafer fabrication system. Method step 1706 shows the end of theprocess.

Referring now to FIG. 18, illustrated is a high-level logic flowchartshowing several examples of the generation and presentation of at leastone relationship between the at least one integral part associated withthe wafer fabrication system and at least one other integral partassociated with the wafer fabrication system referenced in method step1704. Method step 1800 illustrates that in one instance, the generationand presentation of at least one relationship between the at least oneintegral part associated with the wafer fabrication system and at leastone other integral part associated with the wafer fabrication systemreferenced in method step 1704 can include accessing at least onemapping between the at least one integral part associated with the waferfabrication system and the at least one other part of the waferfabrication system. Method step 1802 depicts that in one instance, thegeneration and presentation of at least one relationship between the atleast one integral part associated with the wafer fabrication system andat least one other integral part associated with the wafer fabricationsystem referenced in method step 1704 can further include presenting theat least one mapping between the at least one integral part associatedwith the wafer fabrication system and the at least one other part of thewafer fabrication system. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 19, shown is a high-level logic flow chart showingan example of the accessing at least one mapping between the at leastone integral part associated with the wafer fabrication system and theat least one other part of the wafer fabrication system referenced inmethod step 1800. Method step 1900 illustrates that in one instance,accessing at least one mapping between the at least one integral partassociated with the wafer fabrication system and the at least one otherpart of the wafer fabrication system, referenced in method step 1800,can be the recalling of at least one granular mapping between the atleast one integral part associated with the wafer fabrication system andat least one integral part selected from the group including but notlimited to any components, controls, or connections associated with thewafer fabrication system. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 20, shown is a high-level logic flowchart showingan example of how the identification of at least one integral partassociated with a wafer fabrication system, referenced in method step1702, can be achieved. Method step 2000 illustrates that in oneinstance, the identification of at least one integral part associatedwith a wafer fabrication system referenced in method step 1702 can beachieved by the identification of at least one integral part on agranular basis. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 21, shown is a high-level logic flowchart showingan example of the identification of at least one integral part done on agranular basis as is referenced in method stop 2000. Method step 2100illustrates that in one instance, the identification of at least oneintegral part on a granular basis, referenced in method step 2000,involves identifying at least one component (as the term component isdefined and used herein) associated with the wafer fabrication system.The remaining shown steps function substantially as like-numbered stepsdescribed previously.

Referring now to FIG. 22, shown is a high-level logic flowchart showingseveral examples of the identification of the at least one component (asthe term component is defined and used herein) associated with the waferfabrication system referenced in method step 2100. Method step 2200illustrates that in a first instance, the identification of the at leastone component (as the term component is defined and used herein)associated with the wafer fabrication system, referenced in method step2100, can involve identifying at least one production tool. Method step2202 illustrates that in a second instance, the identification of the atleast one component (as the term component is defined and used herein)associated with the wafer fabrication system, referenced in method step2100, can involve identifying at least one sub-unit of at least oneproduction tool. Method step 2206 illustrates that in a third instance,the identification of the at least one component (as the term componentis defined and used herein) associated with the wafer fabricationsystem, referenced in method step 2100, can involve identifying at leastone item of utility system equipment. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 23, shown is a high-level logic flowchart showingan example of the identification of at least one integral part on agranular basis as is referenced in method stop 2000. Method step 2300illustrates that in one instance, the identification of at least oneintegral part on a granular basis, referenced in method step 2000,involves identifying at least one control (as the term control isdefined and used herein) associated with the wafer fabrication system.The remaining shown steps function substantially as like-numbered stepsdescribed previously.

Referring now to FIG. 24, shown is a high-level logic flowchart showingseveral examples of the identification of the at least one control (asthe term control is defined and used herein) associated with the waferfabrication system referenced in method step 2300. Method step 2402illustrates that in a first instance, the identification of the at leastone control (as the term control is defined and used herein) associatedwith the wafer fabrication system, referenced in method step 2300, caninvolve identifying at least one sub-unit of at least one productiontool. Method step 2404 illustrates that in a second instance, theidentification of the at least one control (as the term control isdefined and used herein) associated with the wafer fabrication system,referenced in method step 2303, can involve identifying at least oneitem of utility system equipment. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 25, shown is a high-level logic flowchart showingan example of the identification of at least one integral part on agranular basis as is referenced in method stop 2000. Method step 2500illustrates that in one instance, the identification of at least oneintegral part done on a granular basis, referenced in method step 2000,can involve identifying at least one connection (as the term connectionis defined and used herein) associated with the wafer fabricationsystem. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 26, shown is a high-level logic flowchart showingseveral examples of the selection of at least one connection (as theterm connection is defined and used herein) associated with the waferfabrication system referenced in method step 2500. Method step 2600illustrates that in a first instance, the selection of the at least oneconnection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step2500, can involve selecting at least one production tool. Method step2602 illustrates that in a second instance, the selection of the atleast one connection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step2500, can involve selecting at least one utility system. Method step2604 illustrates that in one instance, the selection of the at least oneconnection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step2500, can involve selecting at least one item of utility systemequipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 27, shown is a high-level logic flowchart showingan example of the generation and presentation of at least onerelationship between the at least one integral part associated with thewafer fabrication system and at least one other integral part associatedwith the wafer fabrication system referenced in method step 1704. Methodstep 2700 illustrates that in an one instance, the generation andpresentation of at least one relationship between the at least oneintegral part associated with the wafer fabrication system and at leastone other integral part associated with the wafer fabrication system,referenced in method step 1704, involves recalling at least one orderingscheme. Method step 2702 further illustrates that in an one instance,the generation and presentation of at least one relationship between theat least one integral part associated with the wafer fabrication systemand at least one other integral part associated with the waferfabrication system, referenced in method step 1704, further involvesgenerating a presentation based on the recalled ordering scheme and theat least one mapping. The remaining shown steps function substantiallyas like-numbered steps described previously.

Referring now to FIG. 28, shown is a high-level logic flowchart showingan example of recalling at least one ordering scheme referenced inmethod step 2700. Method step 2800 illustrates that in an one instance,recalling at least one ordering scheme, referenced in method step 2700,involves displaying one or more different presentation options inresponse to at least one mapping, referenced in step 1800. Method step2802 further illustrates that in an one instance, recalling at least oneordering scheme, referenced in method step 2700, further involvesaccepting user input selective of the displayed one ore more differentpresentation options. Method step 2804 further illustrates that in anone instance, recalling at least one ordering scheme, referenced inmethod step 2700, further involves recalling at least one orderingscheme in response to the accepted user input selective of the displayedone or more different presentation options. The remaining shown stepsfunction substantially as like-numbered steps described previously.

Those skilled in the art will recognize that the “granular” approachused herein will allow virtually any ordering scheme (such as theordering schemes referenced in method steps 2700 and 2804) to beutilized to impose an order on a captured aspects of an evolving waferfabrication system. Referring now to FIGS. 29A and 29B, shown is oneordering scheme which can be utilized to impose order on the capturedaspects of an evolving system. As has been discussed above, processesand devices used herein deconstruct what was heretofore viewed as anumber of interconnected systems into an amalgamation of granular units.One way in which this deconstructed information can be reconstructed, orordered, is as shown in FIG. 29A. FIG. 29A shows grouping based onfacilities engineering concepts. Shown in FIG. 29A is that an orderingscheme can be devised (e.g., one based on tool groups, such as thescheme illustrated in FIG. 29) to order the granular parts in a fashiondesired. Shown in FIG. 29A is that each CCC (component, connection, orcontrol), can be paired with an indicator of order. For example,PTL.CCC1 is indicate of Production Tool Head, CCC Item 1, which definesthe place of CCC Item 1 in the PTLG. Many more such exemplary orderingsare also illustrated in FIG. 29A, which are substantiallyself-explanatory. In addition, Appendix A, which is hereby incorporatedby reference in its entirety, gives more detail on the ordering schemeshown in FIG. 29A. Lastly, those skilled in the art will recognize thatthe ordering scheme shown is merely exemplary and that the “granular”nature of the captured evolving system will allow the imposition ofvirtually any order on the granular parts in accordance with the spiritof the foregoing example.

FIG. 29B shows pictographically some the aspects set forth in FIG. 29A.Shown in FIG. 29B is connection ordering example 2900 which has theordering scheme of FIG. 29A. Depicted is that connection 2902 (shown asa pipe) has a central (toward a point of origin) coupling and aperipheral (toward a point of use) coupling. Depicted in controlordering example 2906 is that control 2908 (shown as a valve) has acentral (toward a point of origin) coupling 2910 and a peripheral(toward from a point of use) coupling 2912. Illustrated in componentordering example 2914 is a way in which mechanical, electrical,chemical, and thermal relationships could be ordered and presented.

Those skilled in the art will recognize that the one or morepresentation options referenced in method step 2800 will depend upon thetype and amount of mapped information available for selected one or moreparts. Additionally, those skilled in the art will appreciate that avariety of schemes can be utilized to achieve the acceptance of userinput such as was referenced in method step 2804.

FIGS. 30A through 30H show example screen prints of various presentationoptions and user input schemes in the context of a graphical userinterface. FIGS. 30A, B, and C show a generic CCC screen layout anddescribe the information presented and the functions from which the usermay select. FIGS. 30D, E, F, G, and H show a presentation of theordering scheme depicted FIG. 29A, using the screen format from FIGS.30A, B, and C. In the series, they simulate user mouse clicks choiceswith resultant screen changes and new information presented. Lastly,those skilled in the art will recognize that the input presentationsschemes shown are merely exemplary and that the nature of the capturedevolving system will allow the use of virtually any presentation andinput scheme within the spirit of the foregoing example.

III. Determining Impacts of Action Involving the Evolving WaferFabrication System

As was noted in the Description of the Related Art section, above, asignificant problem that arises with respect to an evolving waferfabrication system is that such a system's evolving nature makes it verydifficult to predict with any accuracy the one or more impacts a certainaction taken on, or with respect to, one or more particular integralparts of the wafer fabrication system may produce. The foregoingdescribed various processes and devices whereby an evolving waferfabrication system could be partially or wholly captured at virtuallyany point in its evolution and from virtually any point within the waferfabrication system. Once the wafer fabrication system has been captured,in whole or in part, the capture data can be utilized to predict impactswithin the wafer fabrication system with an accuracy heretoforeunavailable via the use of processes and devices described below.

Referring now to FIGS. 53A and 53B, shown is a high-level partiallyschematic diagram depicting a process by which one or more impacts uponan evolving wafer fabrication system may be known. Method step 5300depicts the start of the process. Method step 5302 illustrates thespecification (typically done by a human user selecting between variouspresentation options by clicking a button on a graphical user interface)of some action (e.g., deleting production tool 102 is shown for sake ofillustration, but those skilled in the art will recognize that theaction could entail many other actions, such as shutting down a utilitysystem, modifying a production tool, adding a production tool, etc.)related to wafer fabrication system 100. For sake of illustration,method step 5304 shows the identification of a wafer fabrication systemthat would be extant subsequent to the execution of the actionspecified, but it is to be understood that in one embodiment thespecified change is translated directly to granular impact; shown forexemplary purposes, in the context of wafer fabrication system 100 thatwas depicted in FIG. 1A, is that the specified action results in theresultant wafer fabrication system 100 sans one or more of the integralparts associated with production tool 102. Method step 5306 shows theidentification of one or more “granular” integral parts within agranular scheme, which for sake of illustration is shown as the“granular scheme” of FIG. 1B, directly or indirectly (e.g., through oneor more mapped interactions and/or one or more other granular integralparts) affected by the specified action. Method step 5308 depicts thediscernment, or recalling, of one or more mapped interactions (e.g.,mechanical, electrical, chemical, and/or thermal couplings which werediscussed above) between or involving the identified one or moregranular integral parts directly or indirectly affected by the specifiedaction related to wafer fabrication system 100. Method step 5310illustrates the specification of a particular presentation format(typically accomplished via a human user selecting between variouspresentation options by clicking a button on a graphical userinterface). Method step 5312 shows the generation of a presentation in amanner consistent with the selected presentation option and theidentified one or more granular integral parts directly or indirectlyaffected by the specified action related to wafer fabrication system100. As will be discussed below, the presentation can be in any format,and the fact that the presentation is generated using the granularformat should not be taken to mean that the presentation must be ingranular format. Rather, the granular format allows virtually infiniteflexibility in presentation, as will become apparent below.

Referring now to FIG. 31, depicted is a high-level logic flowchart of aprocess by which one or more impacts upon an evolving wafer fabricationsystem may be known. Method step 3100 shows the start of the process.Method step 3104 shows the specification of at least one action relatedto an identified integral part associated with a wafer fabricationsystem. Method step 3106 illustrates the generation and presentation ofat least one impact upon at least one integral part associated with thewafer fabrication system arising from the at least one action related tothe at least one integral part associated with the wafer fabricationsystem. Method step 3107 shows the end of the process.

Referring now to FIG. 32, shown is a high-level logic flowchart showingseveral examples of the specification of at least one action related tothe identified integral part associated with a wafer fabrication system,referenced in method step 3104. Method step 3200 illustrates that in afirst instance, the specification of at least one action related to anidentified integral part associated with a wafer fabrication system,referenced in method step 3104, can involve specifying at least oneaddition of at least one production tool to the wafer fabricationsystem. Method step 3202 illustrates that in a second instance, thespecification of at least one action related to the identified integralpart associated with a wafer fabrication system, referenced in methodstep 3104, can involve specifying at least one modification of at leastone production tool within the wafer fabrication system. Method step3204 illustrates that in a third instance, the specification of at leastone action related to the identified integral part associated with awafer fabrication system, referenced in method step 3104, can involvespecifying at least one modification of at least one utility within thewafer fabrication system. Method step 3206 illustrates that in a fourthinstance, the specification of at least one action related to theidentified integral part associated with a wafer fabrication system,referenced in method step 3104, can involve specifying at least oneaddition of at least one utility within the wafer fabrication system.Method step 3208 illustrates that in a fifth instance, the specificationof at least one action related to the identified integral partassociated with a wafer fabrication system, referenced in method step3104, can involve specifying at least one relocation of at least oneproduction tool within the wafer fabrication system. Method step 3210illustrates that in a sixth instance, the specification of at least oneaction related to the identified integral part associated with a waferfabrication system, referenced in method step 3104, can involvespecifying at least one removal of at least one production tool from thewafer fabrication system. Method step 3212 illustrates that in a seventhinstance, the specification of at least one action related to theidentified integral part associated with a wafer fabrication system,referenced in method step 3104, can involve specifying at least onedeletion of at least one utility from the wafer fabrication system. Theremaining shown steps function substantially as like-numbered stepsdescribed previously.

Referring now to FIG. 33, shown is a high-level logic flow chart showingan example of the generation and presentation of at least one impactupon at least one integral part associated with the wafer fabricationsystem arising from the at least one action related to the at least oneintegral part associated with the wafer fabrication system referenced inmethod step 3106. Method step 3300 illustrates that in one instance, thegeneration and presentation of at least one impact upon at least oneintegral part associated with the wafer fabrication system arising fromthe at least one action related to the at least one integral partassociated with the wafer fabrication system, referenced in method step3106, can include identifying at least one directly-affected integralpart of the wafer fabrication system, with the directly-affectedintegral part being directly-affected by the action related to the atleast one integral part associated with the wafer fabrication system.Method step 3302 shows that in one instance, the generation andpresentation of at least one impact upon at least one integral partassociated with the wafer fabrication system arising from the at leastone action related to the at least one integral part associated with thewafer fabrication system 3106, can include presenting at least oneimpact selected from the group including but not limited to one or moreeffects upon the one or more directly-affected integral parts of thewafer fabrication system. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 34, shown is a high-level logic flowchart showingan example of identifying at least one directly-affected integral partof the wafer fabrication system, with the directly-affected integralpart being directly affected by the action related to the at least oneintegral part associated with the wafer fabrication system, referencedin method step 3300. Method step 3400 illustrates that in a firstinstance, the identifying at least one directly-affected⁶ integral partof the wafer fabrication system, with the directly-affected integralpart being directly affected by the action related to the at least oneintegral part associated with the wafer fabrication system, referencedin method step 3300, can include identifying at least onemechanically-affected integral part of the wafer fabrication system.Method step 3402 illustrates that in a second instance, the identifyingat least one directly-affected integral part of the wafer fabricationsystem, with the directly-affected integral part being directly affectedby the action related to the at least one integral part associated withthe wafer fabrication system, referenced in method step 3300, caninclude identifying at least one electrically-affected integral part ofthe wafer fabrication system. Method step 3404 illustrates that in athird instance, the identifying at least one directly-affected integralpart of the wafer fabrication system, with the directly-affectedintegral part being directly affected by the action related to the atleast one integral part associated with the wafer fabrication system,referenced in method step 3300, can include identifying at least onechemically-affected integral part of the wafer fabrication system.Method step 3406 illustrates that in a fourth instance, the identifyingat least one directly-affected integral part of the wafer fabricationsystem, with the directly-affected integral part being directly affectedby the action related to the at least one integral part associated withthe wafer fabrication system, referenced in method step 3300, caninclude identifying at least one thermally-affected integral part of thewafer fabrication system. The remaining shown steps functionsubstantially as like-numbered steps described previously.

⁶ As used herein, “directly-affected” can mean affected through directaction (e.g., mechanical, electrical, chemical, or thermal) upon a firstintegral part, and can also mean that the affecting is through acoupling (e.g., mechanical, electrical, chemical, or thermal) betweenthe first integral part and a second integral part. Indirectly-affectedcan mean that at least a third intermediary integral part and itsattendant couplings reside between a first and a second integral part,indirectly-coupled.

Referring now to FIG. 35, shown is a high-level logic flowchart showingan example of how identifying at least one directly-affected integralpart of the wafer fabrication system, with the directly-affectedintegral part being directly affected by the action related to the atleast one integral part associated with the wafer fabrication system,referenced in method step 3300. Method step 3500 illustrates that in afirst instance, the identifying at least one directly-affected integralpart of the wafer fabrication system, with the directly-affectedintegral part being directly affected by the action related to the atleast one integral part associated with the wafer fabrication system,referenced in method step 3300, can include identifying at least onedirectly-affected production tool of the wafer fabrication system on agranular basis. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 40, shown is a high-level logic flowchart showingan example of identification of the at least one directly affectedintegral part on a granular basis as is referenced in method step 3500.Method step 4000 illustrates that in one instance, the identification ofat least one directly affected integral part on a granular basis,referenced in method step 3500, can involve identifying at least onedirectly affected component (as the term component is defined and usedherein) associated with the wafer fabrication system. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 41, shown is a high-level logic flowchart showingseveral examples of identification of at least one directly affectedcomponent (as the term component is defined and used herein) associatedwith the wafer fabrication system referenced in method step 4000. Methodstep 4100 illustrates that in a first instance, the identification ofthe at least one directly affected component (as the term component isdefined and used herein) associated with the wafer fabrication system,referenced in method step 4000, can involve identifying at least oneproduction tool. Method step 4102 illustrates that in a second instance,the identification of the at least one directly affected component (asthe term component is defined and used herein) associated with the waferfabrication system, referenced in method step 4000, can involveidentifying at least one directly affected sub-unit of at least oneproduction tool. Method step 4106 illustrates that in a third instance,the identification of the at least one directly affected component (asthe term component is defined and used herein) associated with the waferfabrication system, referenced in method step 4000, can involveidentifying at least one directly affected item of utility systemequipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 42, shown is a high-level logic flowchart showingan example of identification of at least one directly affected integralpart on a granular basis as is referenced in method stop 3500. Methodstep 4200 illustrates that in one instance, the identification of atleast one directly affected integral part on a granular basis,referenced in method step 3500, can involve identifying at leastdirectly affected one control (as the term control is defined and usedherein) associated with the wafer fabrication system. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 43, shown is a high-level logic flowchart showingseveral examples of the identification of the at least one directlyaffected control (as the term control is defined and used herein)associated with the wafer fabrication system referenced in method step4200. Method step 4302 illustrates that in a first instance, theidentification of the at least one directly affected control (as theterm control is defined and used herein) associated with the waferfabrication system, referenced in method step 4200, can involveidentifying at least one directly affected sub-unit of at least oneproduction tool. Method step 4304 illustrates that in a second instance,the identification of the at least one directly affected control (as theterm control is defined and used herein) associated with the waferfabrication system, referenced in method step 4200, can involveidentifying at least one directly affected item of utility systemequipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 44, shown is a high-level logic flowchart showingan example of the identification of at least one directly affectedintegral part on a granular basis as is referenced in method stop 3500.Method step 4500 illustrates that in one instance, the identification ofat least one directly affected integral part on a granular basis,referenced in method step 3500, involves identifying at least onedirectly affected connection (as the term connection is defined and usedherein) associated with the wafer fabrication system. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 45, shown is a high-level logic flowchart showingseveral examples of the identification of at least one directly affectedconnection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step4400. Method step 4500 illustrates that in a first instance, theidentification of the at least one directly affected connection (as theterm connection is defined and used herein) associated with the waferfabrication system, referenced in method step 4400, can involveidentifying at least one directly affected production tool. Method step4502 illustrates that in a second instance, the identification of the atleast one directly affected connection (as the term connection isdefined and used herein) associated with the wafer fabrication system,referenced in method step 4400, can involve identifying at least onedirectly affected utility system. Method step 4504 illustrates that inone instance, the identification of the at least one directly affectedconnection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step4400, can involve identifying at least one directly affected item ofutility system equipment. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 36, shown is a high-level logic flowchart showinga process wherein indirectly-affected integral parts of a waferfabrication system are taken into account. Method step 3600 illustratesthat subsequent to method step 3302, identification is made of at leastone indirectly-affected integral part of the wafer fabrication systemlinked with the at least one directly-affected integral part of thewafer fabrication system. Thereafter, method step 3602 illustrates thatpresentation is made of at least one impact selected from the groupincluding and one or more effects upon the one or moreindirectly-affected integral parts of the wafer fabrication systemlinked with the one or more directly-affected integral parts of thewafer fabrication system. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 37, shown is a high-level logic flowchart showingexamples of the identification of at least one indirectly-affectedintegral part of the wafer fabrication system linked with the at leastone directly-affected integral part of the wafer fabrication systemreferenced in 3602. Method step 3700 illustrates that in a firstinstance, the identification of at least one indirectly-affectedintegral part of the wafer fabrication system linked with the at leastone directly-affected integral part of the wafer fabrication system,referenced in method step 3602, can include identifying at least oneindirectly-affected integral part of the wafer fabrication system on agranular basis. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 38, shown is a high-level logic flowchart showingan example of identifying at least one indirectly-affected integral partof the wafer fabrication system linked with the at least onedirectly-affected integral part of the wafer fabrication systemreferenced in method step 3600. Method step 3800 illustrates that in oneinstance, the identifying at least one directly-affected integral partof the wafer fabrication system linked with the at least onedirectly-affected integral part of the wafer fabrication, referenced inmethod step 3600, includes identifying at least one mapped interactionbetween an integral part of the wafer fabrication system and the atleast one indirectly-affected integral part of the wafer fabricationsystem. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 39, shown is a high-level logic flowchart showingan example of the identifying at least one coupling between an integralpart of the wafer fabrication system and the at least onedirectly-affected integral part of the wafer fabrication system asreferenced in method stop 3800. Method step 3900 depicts that in a firstinstance, identifying at least one coupling between an integral part ofthe wafer fabrication system and the at least one directly-affectedintegral part of the wafer fabrication system as referenced in methodstop 3800, includes identifying at least one mechanical coupling betweenan integral part of the wafer fabrication system and the at least onedirectly-affected integral part of the wafer fabrication system. Methodstep 3902 depicts that in a second instance, identifying at least onecoupling between an integral part of the wafer fabrication system andthe at least one directly-affected integral part of the waferfabrication system as referenced in method stop 3800, includesidentifying at least one electrical coupling between an integral part ofthe wafer fabrication system and the at least one directly-affectedintegral part of the wafer fabrication system. Method step 3904 depictsthat in a third instance, identifying at least one coupling between anintegral part of the wafer fabrication system and the at least onedirectly-affected integral part of the wafer fabrication system asreferenced in method stop 3800, includes identifying at least onechemical coupling between an integral part of the wafer fabricationsystem and the at least one directly-affected integral part of the waferfabrication system. Method step 3906 depicts that in a fourth instance,identifying at least one coupling between an integral part of the waferfabrication system and the at least one directly-affected integral partof the wafer fabrication system as referenced in method stop 3800,includes identifying at least one thermal coupling between an integralpart of the wafer fabrication system and the at least onedirectly-affected integral part of the wafer fabrication system. Theremaining shown steps function substantially as like-numbered stepsdescribed previously.

Referring now to FIG. 46, shown is a high-level logic flowchart showingan example of the identification of the at least one indirectly affectedintegral part on a granular basis as is referenced in method stop 3700.Method step 4600 illustrates that in one instance, the identification ofat least one indirectly affected integral part on a granular basis,referenced in method step 3700, can involve identifying at least oneindirectly affected component (as the term component is defined and usedherein) associated with the wafer fabrication system. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 47, shown is a high-level logic flowchart showingseveral examples of identification of at least one indirectly affectedcomponent (as the term component is defined and used herein) associatedwith the wafer fabrication system referenced in method step 4600. Methodstep 4700 illustrates that in a first instance, the identification ofthe at least one indirectly affected component (as the term component isdefined and used herein) associated with the wafer fabrication system,referenced in method step 4600, can involve identifying at least oneindirectly affected production tool. Method step 4702 illustrates thatin a second instance, the identification of the at least one indirectlyaffected component (as the term component is defined and used herein)associated with the wafer fabrication system, referenced in method step4600, can involve identifying at least one indirectly affected sub-unitof at least one production tool. Method step 4706 illustrates that in athird instance, the identification of the at least one indirectlyaffected component (as the term component is defined and used herein)associated with the wafer fabrication system, referenced in method step4600, can involve identifying at least one indirectly affected item ofutility system equipment. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Referring now to FIG. 48, shown is a high-level logic flowchart showingan example of the identification of at least one indirectly affectedintegral part on a granular basis as is referenced in method stop 3700.Method step 4800 illustrates that in one instance, the identification ofat least one indirectly affected integral part on a granular basis,referenced in method step 3700, can involve identifying at leastindirectly affected one control (as the term control is defined and usedherein) associated with the wafer fabrication system. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 49, shown is a high-level logic flowchart showingseveral examples of the identification of the at least one indirectlyaffected control (as the term control is defined and used herein)associated with the wafer fabrication system referenced in method step4800. Method step 4902 illustrates that in a first instance, theidentification of the at least one indirectly affected control (as theterm control is defined and used herein) associated with the waferfabrication system, referenced in method step 4800, can involveidentifying at least one indirectly affected sub-unit of at least oneproduction tool. Method step 4904 illustrates that in a second instance,the identification of the at least one indirectly affected control (asthe term control is defined and used herein) associated with the waferfabrication system, referenced in method step 4800, can involveidentifying at least one indirectly affected item of utility systemequipment. The remaining shown steps function substantially aslike-numbered steps described previously.

Referring now to FIG. 50, shown is a high-level logic flowchart showingan example of the identification of at least one indirectly affectedintegral part on a granular basis as is referenced in method stop 3700.Method step 5100 illustrates that in one instance, the identification ofat least one indirectly affected integral part on a granular basis,referenced in method step 3700, involves identifying at least oneindirectly affected connection (as the term connection is defined andused herein) associated with the wafer fabrication system. The remainingshown steps function substantially as like-numbered steps describedpreviously.

Referring now to FIG. 51, shown is a high-level logic flowchart showingseveral examples of the identification of at least one indirectlyaffected connection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step5000. Method step 5100 illustrates that in a first instance, theidentification of the at least one indirectly affected connection (asthe term connection is defined and used herein) associated with thewafer fabrication system, referenced in method step 5000, can involveidentifying at least one indirectly affected production tool. Methodstep 5102 illustrates that in a second instance, the identification ofthe at least one indirectly affected connection (as the term connectionis defined and used herein) associated with the wafer fabricationsystem, referenced in method step 5000, can involve identifying at leastone indirectly affected utility system. Method step 5104 illustratesthat in one instance, the identification of the at least one indirectlyaffected connection (as the term connection is defined and used herein)associated with the wafer fabrication system, referenced in method step5000, can involve identifying at least one indirectly affected item ofutility system equipment. The remaining shown steps functionsubstantially as like-numbered steps described previously.

Method step 3302 referenced presentation of at least one impact selectedfrom the group including one or more effects upon the one or moredirectly-affected integral parts of the wafer fabrication system. Methodstep 3602 referenced presentation of at least one impact selected fromthe group including the one or more effects upon the one or moreindirectly-affected integral parts of the wafer fabrication system.

In so far as specifying at least one action relates to the at least oneintegral part referenced in method step 3104 will, in some sense, resultin the generation of a “hypothetical” wafer fabrication system definedby the direct and/or indirect effects of the specified action, thoseskilled in the art will recognize that the presentation of the impactsreferenced in method steps 3302 and 3602 can be achieved via the use ofthe process and devices referenced in generating presentation ofrelationships involving integral parts of evolving wafer fabricationsystem with substantially minimal modifications.

Referring now to FIG. 54, shown is a proposed graphical user interface,to be viewed against the background of FIGS. 30A-30H, which can beutilized to accept a user specification of an action on at least oneintegral part of a wafer fabrication system, such as was referenced inmethod step 3104. Although not explicitly shown, those skilled willrecognize that graphical presentation techniques, notorious within theart, can be utilized to produce graphical presentations of the foregoingdescribed effects of a proposed action (exactly what impacts will bepresented is a design choice) since, as has been discussed, typically(but not always) the results of the proposed action will take the formof a new set of relationships between integral parts of the waferfabrication system, which can thereafter be presented in the mannerdiscussed previously. The graphical user interfaces can be generated bya multitude of programming techniques well known to those within theart.

The foregoing detailed description set forth various embodiments of thepresent invention via the use of block diagrams, flowcharts, andexamples. It will be understood as notorious by those within the artthat each block diagram component, flowchart step, and operations and/orcomponents illustrated by the use of examples can be implemented,individually and/or collectively, by a wide range of hardware, software,firmware, or any combination thereof. In one embodiment, the presentinvention is implemented via standard relational database products.However, those skilled in the art will recognize that the embodimentsdisclosed herein, in whole or in part, can be equivalently implementedin Application Specific Integrated Circuits (ASICs), standard IntegratedCircuits, as a computer program running on a computer, as firmware, oras virtually any combination thereof and that designing the circuitryand/or writing the code for the software or firmware would be wellwithin the skill of one of ordinary skill in the art in light of thisdisclosure.

The foregoing described embodiments depict different componentscontained within, or connected with, different other components. It isto be understood that such depicted architectures are merely exemplary,and that in fact many other architectures can be implemented whichachieve the same functionality. In an abstract, but still definite,sense those within the art will appreciate that any arrangement ofcomponents to achieve the same functionality is effectively “associated”such that the desired functionality is achieved. Hence, any twocomponents herein combined to achieve a particular functionality can beseen as “associated with” each other such that the desired functionalityis achieved, irrespective of architectures or intermedial components.Likewise, any two components so associated can also be viewed as being“operably connected”, or “operably coupled”, to each other to achievethe desired functionality.

Other embodiments are within the following claims.

While particular embodiments of the present invention have been shownand described, it will be obvious to those skilled in the art that,based upon the teachings herein, changes and modifications may be madewithout departing from this invention and its broader aspects and,therefore, the appended claims are to encompass within their scope allsuch changes and modifications as are within the true spirit and scopeof this invention. Furthermore, it is to be understood that theinvention is solely defined by the appended claims. It will beunderstood by those within the art that if a specific number of anintroduced claim element is intended, such an intent will be explicitlyrecited in the claim, and in the absence of such recitation no suchlimitation is present. For non-limiting example, as an aid tounderstanding, the following appended claims contain usage of theintroductory phrases “at least one” and “one or more” to introduce claimelements. However, the use of such phrases should not be construed toimply that the introduction of a claim element by the indefinitearticles “a” or “an” limits any particular claim containing suchintroduced claim element to inventions containing only one such element,even when same claim includes the introductory phrases “one or more” or“at least one” and indefinite articles such as “a” or “an”; the sameholds true for the use of definite articles.

What is claimed is:
 1. A method comprising: specifying at least oneaction related to at least one integral part associated with a waferfabrication system; and generating a presentation of at least one impactupon at least one integral part associated with the wafer fabricationsystem arising from the at least one action related to the at least oneintegral part associated with the wafer fabrication system, saidgenerating further comprises: identifying at least one directly-affectedintegral part associated with the wafer fabrication system on a granularbasis; and presenting at least one impact selected from the groupcomprising one or more effects upon the at least one directly-affectedintegral part associated with the wafer fabrication system.
 2. Themethod of claim 1, wherein said identifying the at least onedirectly-affected integral part associated with the wafer fabricationsystem on a granular basis further comprises: identifying at least onedirectly-affected component associated with the wafer fabricationsystem.
 3. The method of claim 2, wherein said identifying at least onedirectly-affected component associated with the wafer fabrication systemfurther comprises: identifying at least one directly-affected productiontool as the at least one component.
 4. The method of claim 2, whereinsaid identifying at least one directly-affected component associatedwith the wafer fabrication system further comprises: identifying atleast one directly-affected sub-unit of at least one production tool asthe at least one component.
 5. The method of claim 2, wherein saididentifying at least one directly-affected component associated with thewafer fabrication system further comprises: identifying at least onedirectly-affected optistation as the at least one component.
 6. Themethod of claim 2, wherein said identifying at least onedirectly-affected component associated with the wafer fabrication systemfurther comprises: identifying at least one item of utility systemequipment of at least one directly-affected utility system as the atleast one component.
 7. The method of claim 1, wherein said identifyingthe at least one directly-affected integral part associated with thewafer fabrication system on a granular basis further comprises:identifying at least one directly-affected control associated with thewafer fabrication system.
 8. The method of claim 7, wherein saididentifying at least one directly-affected control associated with thewafer fabrication system further comprises: identifying at least onedirectly-affected device that modifies or meters a utility as the atleast one control.
 9. The method of claim 7, wherein said identifying atleast one directly-affected control associated with the waferfabrication system further comprises: identifying at least one of thegroup comprising any valve, damper, circuit breaker, flow meter,transformer, or sensor as the at least one control.
 10. The method ofclaim 7, wherein said identifying at least one directly-affected controlassociated with the wafer fabrication system further comprises:identifying at least one directly-affected item of utility systemequipment of at least one utility system as the at least one control.11. The method of claim 1, wherein said identifying the at least onedirectly-affected integral part associated with the wafer fabricationsystem on a granular basis further comprises: identifying at least onedirectly-affected connection associated with the wafer fabricationsystem.
 12. The method of claim 11, wherein said identifying at leastone directly-affected connection associated with the wafer fabricationsystem further comprises: identifying at least one directly-affectedsub-unit of at least one production tool as the at least one connection.13. The method of claim 11, wherein said identifying at least onedirectly-affected connection associated with the wafer fabricationsystem further comprises: identifying at least one directly-affectedutility system as the at least one connection.
 14. The method of claim11, wherein said identifying at least one directly-affected connectionassociated with the wafer fabrication system further comprises:identifying at least one directly-affected item of utility systemequipment of at least one utility system as the at least one connection.15. A method comprising: specifying at least one action related to atleast one integral part associated with a wafer fabrication system; andgenerating a presentation of at least one impact upon at least oneintegral part associated with the wafer fabrication system arising fromthe at least one action related to the at least one integral partassociated with the wafer fabrication system wherein said generating apresentation of at least one impact upon at least one integral partassociated with the wafer fabrication system arising from the actionrelated to the at least one integral part associated with the waferfabrication system further comprises: identifying at least onedirectly-affected integral part associated with the wafer fabricationsystem, and presenting at least one impact selected from the groupcomprising one or more effects upon the at least one directly-affectedintegral part associated with the wafer fabrication system, identifyingat least one indirectly-affected integral part associated with the waferfabrication system coupled with the at least one directly-affectedintegral part associated with the wafer fabrication system; andpresenting at least one impact selected from the group comprising one ormore effects upon the at least one indirectly-affected integral partassociated with the wafer fabrication system linked with the one or moredirectly-affected integral parts of the wafer fabrication system;wherein said identifying at least one indirectly-affected integral partassociated with the wafer fabrication system further comprises:identifying the at least one indirectly-affected integral partassociated with the wafer fabrication system on a granular basis. 16.The method of claim 15, wherein said identifying the at least oneindirectly-affected integral part associated with the wafer fabricationsystem on a granular basis further comprises: identifying at least oneindirectly-affected component associated with the wafer fabricationsystem.
 17. The method of claim 16, wherein said identifying at leastone indirectly-affected component associated with the wafer fabricationsystem further comprises: identifying at least one indirectly-affectedproduction tool as the at least one component.
 18. The method of claim16, wherein said identifying at least one indirectly-affected componentassociated with the wafer fabrication system further comprises:identifying at least one indirectly-affected sub-unit of at least oneproduction tool as the at least one component.
 19. The method of claim16, wherein said identifying at least one indirectly-affected componentassociated with the wafer fabrication system further comprises:identifying at least one indirectly-affected utility system as the atleast one component.
 20. The method of claim 16, wherein saididentifying at least one indirectly-affected component associated withthe wafer fabrication system further comprises: identifying at least oneitem of utility system equipment of at least one indirectly-affectedutility system as the at least one component.
 21. The method of claim15, wherein said identifying the at least one indirectly-affectedintegral part associated with the wafer fabrication system on a granularbasis further comprises: identifying at least one indirectly-affectedcontrol associated with the wafer fabrication system.
 22. The method ofclaim 21, wherein said identifying at least one indirectly-affectedcontrol associated with the wafer fabrication system further comprises:identifying at least one indirectly-affected device that modifies ormeters a utility as the at least one control.
 23. The method of claim21, wherein said identifying at least one indirectly-affected controlassociated with the wafer fabrication system further comprises:identifying at least one of the group comprising any valve, damper,circuit breaker, flow meter, transformer, or sensor as the at least onecontrol.
 24. The method of claim 21, wherein said identifying at leastone indirectly-affected control associated with the wafer fabricationsystem further comprises: identifying at least one indirectly-affecteditem of utility system equipment of at least one utility system as theat least one control.
 25. The method of claim 15, wherein saididentifying the at least one indirectly-affected integral partassociated with the wafer fabrication system on a granular basis furthercomprises: identifying at least one indirectly-affected connectionassociated with the wafer fabrication system.
 26. The method of claim25, wherein said identifying at least one indirectly-affected connectionassociated with the wafer fabrication system further comprises:identifying at least one directly-affected sub-unit of at least oneproduction tool as the at least one connection.
 27. The method of claim25, wherein said identifying at least one indirectly-affected connectionassociated with the wafer fabrication system further comprises:identifying at least one indirectly-affected utility system as the atleast one connection.
 28. The method of claim 25, wherein saididentifying at least one indirectly-affected connection associated withthe wafer fabrication system further comprises: identifying at least oneindirectly-affected item of utility system equipment of at least oneutility system as the at least one connection.
 29. A system comprising:means for specifying at least one action related to at least oneintegral part associated with a wafer fabrication system; and means forgenerating a presentation of at least one impact upon at least oneintegral part associated with the wafer fabrication system arising fromthe at least one action related to the at least one integral partassociated with the wafer fabrication system, said means for generatingfurther comprises: means for identifying at least one directly-affectedintegral part associated with the wafer fabrication system on a granularbasis; and means for presenting at least one impact selected from thegroup comprising one or more effects upon the at least onedirectly-affected integral part associated with the wafer fabricationsystem.
 30. The system of claim 29, wherein said means for identifyingthe at least one directly-affected integral part associated with thewafer fabrication system on a granular basis further comprises: meansfor identifying at least one directly-affected component associated withthe wafer fabrication system.
 31. The system of claim 30, wherein saidmeans for identifying at least one directly-affected componentassociated with the wafer fabrication system further comprises: meansfor identifying at least one directly-affected production tool as the atleast one component.
 32. The system of claim 30, wherein said means foridentifying at least one directly-affected component associated with thewafer fabrication system further comprises: means for identifying atleast one directly-affected sub-unit of at least one production tool asthe at least one component.
 33. The system of claim 30, wherein saidmeans for identifying at least one directly-affected componentassociated with the wafer fabrication system further comprises: meansfor identifying at least one directly-affected optistation as the atleast one component.
 34. The system of claim 30, wherein said means foridentifying at least one directly-affected component associated with thewafer fabrication system further comprises: means for identifying atleast one item of utility system equipment of at least onedirectly-affected utility system as the at least one component.
 35. Thesystem of claim 29, wherein said means for identifying the at least onedirectly-affected integral part associated with the wafer fabricationsystem on a granular basis further comprises: means for identifying atleast one directly-affected control associated with the waferfabrication system.
 36. The system of claim 35, wherein said means foridentifying at least one directly-affected control associated with thewafer fabrication system further comprises: means for identifying atleast one directly-affected device that modifies or meters a utility asthe at least one control.
 37. The system of claim 35, wherein said meansfor identifying at least one directly-affected control associated withthe wafer fabrication system further comprises: means for identifying atleast one of the group comprising any valve, damper, circuit breaker,flow meter, transformer, or sensor as the at least one control.
 38. Thesystem of claim 35, wherein said means for identifying at least onedirectly-affected control associated with the wafer fabrication systemfurther comprises: means for identifying at least one directly-affecteditem of utility system equipment of at least one utility system as theat least one control.
 39. The system of claim 29, wherein said means foridentifying the at least one directly-affected integral part associatedwith the wafer fabrication system on a granular basis further comprises:means for identifying at least one directly-affected connectionassociated with the wafer fabrication system.
 40. A system comprising:means for specifying at least one action related to at least oneintegral part associated with a wafer fabrication system; and means forgenerating a presentation of at least one impact upon at least oneintegral part associated with the wafer fabrication system arising fromthe at least one action related to the at least one integral partassociated with the wafer fabrication system; wherein said means forgenerating a presentation of at least one impact upon at least oneintegral part associated with the Wafer fabrication system arising fromthe action related to the at least one integral part associated with thewafer fabrication system further comprises: means for identifying atleast one directly-affected integral part associated with the waferfabrication system; and means for presenting at least one impactselected from the group comprising one or more effects upon the at leastone directly-affected integral part associated with the waferfabrication system; means for identifying at least oneindirectly-affected integral part associated with the wafer fabricationsystem coupled with the at least one directly-affected integral partassociated with the wafer fabrication system; and means for presentingat least one impact selected from the group comprising one or moreeffects upon the at least one indirectly-affected integral partassociated with the wafer fabrication system linked with the one or moredirectly-affected integral parts of the wafer fabrication system;wherein said means for identifying at least one indirectly-affectedintegral part associated with the wafer fabrication system furthercomprises: means for identifying the at least one indirectly-affectedintegral part associated with the wafer fabrication system on a granularbasis.
 41. The system of claim 40, wherein said means for identifyingthe at least one indirectly-affected integral part associated with thewafer fabrication system on a granular basis further comprises: meansfor identifying at least one indirectly-affected component associatedwith the wafer fabrication system.
 42. The system of claim 41, whereinsaid means for identifying at least one indirectly-affected componentassociated with the wafer fabrication system further comprises: meansfor identifying at least one indirectly-affected production tool as theat least one component.
 43. The system of claim 41, wherein said meansfor identifying at least one indirectly-affected component associatedwith the wafer fabrication system further comprises: means foridentifying at least one indirectly-affected sub-unit of at least oneproduction tool as the at least one component.
 44. The system of claim41, wherein said means for identifying at least one indirectly-affectedcomponent associated with the wafer fabrication system furthercomprises: means for identifying at least one indirectly-affectedutility system as the at least one component.
 45. The system of claim41, wherein said means for identifying at least one indirectly-affectedcomponent associated with the wafer fabrication system furthercomprises: means for identifying at least one item of utility systemequipment of at least one indirectly-affected utility system as the atleast one component.
 46. The system of claim 40, wherein said means foridentifying the at least one indirectly-affected integral partassociated with the wafer fabrication system on a granular basis furthercomprises: means for identifying at least one indirectly-affectedcontrol associated with the wafer fabrication system.
 47. The system ofclaim 46, wherein said means for identifying at least oneindirectly-affected control associated with the wafer fabrication systemfurther comprises: means for identifying at least oneindirectly-affected device that modifies or meters a utility as the atleast one control.
 48. The system of claim 46, wherein said means foridentifying at least one indirectly-affected control associated with thewafer fabrication system further comprises: means for identifying atleast one of the group comprising any valve, damper, circuit breaker,flow meter, transformer, or sensor as the at least one control.
 49. Thesystem of claim 46, wherein said means for identifying at least oneindirectly-affected control associated with the wafer fabrication systemfurther comprises: means for identifying at least oneindirectly-affected item of utility system equipment of at least oneutility system as the at least one control.
 50. The system of claim 46,wherein said means for identifying the at least one indirectly-affectedintegral part associated with the wafer fabrication system on a granularbasis further comprises: means for identifying at least oneindirectly-affected connection associated with the wafer fabricationsystem.
 51. The system of claim 50, wherein said means for identifyingat least one indirectly-affected connection associated with the waferfabrication system further comprises: means for identifying at least onedirectly-affected sub-unit of at least one production tool as the atleast one connection.
 52. The system of claim 50, wherein said means foridentifying at least one indirectly-affected connection associated withthe wafer fabrication system further comprises: means for identifying atleast one indirectly-affected utility system as the at least oneconnection.
 53. The system of claim 50, wherein said means foridentifying at least one indirectly-affected connection associated withthe wafer fabrication system further comprises: means for identifying atleast one indirectly-affected item of utility system equipment of atleast one utility system as the at least one connection.